RESERVED AREA
EN
MICROCREDENTIALS
COURSES
INTRODUCTION
PROGRAMME CONTENTS
APPLICATION
CALENDAR
The microcredential in PCB Design and Soldering Techniques aims to equip trainees with basic electronics concepts: integrated circuit encapsulations and main features, design a two-level printed circuit board (PCB) from the electrical schematic phase to physical implementation (layout), carry out electrical, design rule and /ayout vs. schematic checks, and generate the files for manufacture.
The aim is also to provide trainees with fundamental concepts about the soldering process and component repair, and to introduce efficient techniques for perfect soldering.
The course diploma is a level 5 micro-credential, from the European Qualifications Framework, with 1 ECTS (15 contact hours + 12 hours of autonomous work) and a certificate is awarded on passing the assessment activity.
Attendance regime
The course will take place in person during the post-work period. It is planned to take place in 13 sessions of 1 hour and 2 hours for assessment (written test).
The aim is also to provide trainees with fundamental concepts about the soldering process and component repair, and to introduce efficient techniques for perfect soldering.
The course diploma is a level 5 micro-credential, from the European Qualifications Framework, with 1 ECTS (15 contact hours + 12 hours of autonomous work) and a certificate is awarded on passing the assessment activity.
Attendance regime
The course will take place in person during the post-work period. It is planned to take place in 13 sessions of 1 hour and 2 hours for assessment (written test).
Tuition, fees and emoluments: 100€
C06-i04.01 - Impulso Jovens STEAM
1. Tipos de Encapsulamento Through-Hole (1 horas de contacto + 1 horas de trabalho autónomo)
5.Soldering Techniques on PCBs (3 contact hours + 2 hours of autonomous work)
1.1. DIP/DIL (Pacote duplo em linha)1.2. PDIP/PDIL (Encapsulamento de plástico de linha dupla}1.3. CDIP/CDIL (Pacote cerâmico de linha dupla)1.4. HDIP/HDIL (Pacote de Linha Dupla de Calor}1.5. SDIP/SDIL (Pacote de linha dupla magro}1.6. SPDIP/SPDIL (Pacote de plástico retrátil de linha dupla) 1.7. SIP/SIL (Encapsulamento de linha única}1.8. CPGA (Ceramic Pin Grid Array}
2. Surface Mount Encapsulation Types (1 contact hour + 1 autonomous work hour)
2.1 SOIC (Small Outline Integrated Circuit)2.2 MSOP (Mini Small-Outline Package)2.3 SSOP (Shrink Small-Outline Package)2.4 QSOP (Quarter-size Small Outline Package)2.5. HSOP (Heat Small Outline Integrated Circuit}2.6 TSOP (Thin Small-Outline Package)2.7. TSSOP (Thin-Shrink Small-Outline Package)2.8. QFP (Quad Flat Package)2.9. Exposed Pad (Variant of Small Outline Packages)2.10. PLCC (Plastic Leadless Chip Carrier}
3. PCB Electrical Schematic Design (3 contact hours + 3 hours of autonomous work)
3.1 Parts and Components3.2 Models and Footprint3.3 SMD Types and Dimensions (0402, 0603 and 0805)3.4 Generic Models and Technology Models3.5 Wires, Busbars and Labels3.6 Local Nodes and Global Nodes3.7 Checking Electrical Rules3.8 Schematic/Layout
4. PCB Layout Project (5 contact hours + 5 hours of autonomous work)
4.1 Metal levels4.2 Models and Footprint4.4 Tracks and Routes4.5 Navigation between tracks4.6 Track Diameter and Width4.7. Obstacle Contouring and Filling4.8 Top and Bottom Layers4.9 Checking Design Rules
4.10. Gerber Files and Masks
4.11 Radio Frequency Topics
4.11 Radio Frequency Topics
4.11.1 Angles and Reflection4.11.2 Capacities between Tracks4.11.3 Resistance Minimisation4.11.4 Capacity Minimisation4.11.5 Induction Minimisation4.11.6 Mass Plane and Electrostatic Balance
5.Soldering Techniques on PCBs (3 contact hours + 2 hours of autonomous work)
5.1 Types of Irons5.2 Soldering Components5.3 Flux Preparation and Application5.4 Properties of Copper, Aluminium and Gold5.5 Temperature Adjustment5.6 Pin-to-Pin Soldering5.7 Line soldering5.8 Repairing with Pick-up Mesh/Soldering5.9 Hot Air Blast Welding and Repair5.10. Soldering with Putty
Applications must be made online by the specified deadlines.
Each candidate must complete the application form and attach the following documents:
a. Scanned photocopy of identification document (ID card or passport)
b. Proof of degree qualification, if available.
ENIDH reserves the right to request the submission of additional documentation for the Jury's assessment of the application.
Admission criteria
Those aged 18 or over may apply to attend the micro-credential. If the admission criteria are met, selection will take place in order of enrolment.
Each candidate must complete the application form and attach the following documents:
a. Scanned photocopy of identification document (ID card or passport)
b. Proof of degree qualification, if available.
ENIDH reserves the right to request the submission of additional documentation for the Jury's assessment of the application.
Admission criteria
Those aged 18 or over may apply to attend the micro-credential. If the admission criteria are met, selection will take place in order of enrolment.
